DCW Asia has always been a fantastic trade show for Excool, but this year’s event surpassed all expectations. The hall was buzzing with activity, and our stand was no exception. For the first time ever, Excool brought equipment to the event, shipping our British-built stainless steel Coolant Distribution Unit (CDU) directly to Singapore. This cutting-edge direct-to-chip cooling technology has sparked significant interest across the data center industry in recent months.
Excool offers a comprehensive range of liquid cooling solutions tailored to AI, high-performance computing (HPC), and high-density applications globally. With strategically positioned teams around the world, we ensure that nearly every region is covered, providing efficient and scalable cooling solutions.
As a highly agile organization, Excool is adept at developing custom CDUs, precision cooling wall systems, and Indirect Evaporative Cooling (IDEC) units to meet specific client needs. We can design hybrid cooling systems where precision cooling wall, CDUs, and Chillers work seamlessly together to optimize performance for your data centers.
It was fantastic to reconnect with so many familiar faces at DCW Asia and engage in valuable discussions about the future of data center cooling. The trade show season is now in full swing, and next, the Excool team will be heading to the United States for DCD Connect Virginia in November.
If you’d like more information about the Excool CDU, data center chillers, or our other innovative products, please don’t hesitate to reach out at info@excool.com.
